Cooling Innovation: Silently Battling High-Temperature Environments
The straight backplate cooling design revolutionizes traditional fan-based cooling logic. Through the synergy of aluminum heat conduction plates and honeycomb air ducts, heat is rapidly transferred from the motherboard to the outer chassis.

In an intelligent automated warehouse, the industrial PC is embedded within the shelf columns, with its rear cooling slots aligned to the warehouse ventilation system, utilizing natural airflow for zero-noise cooling. During 7×24 operation, CPU temperature fluctuation does not exceed 5°C. This design is particularly suitable for dust-sensitive environments, such as filling lines in flour processing plants, preventing fan clogging from dust intake while extending equipment lifespan by 30%.

Minimalist Embedding: Industrial Aesthetics Balancing Rigidity and Flexibility
The 3mm ultra-thin aluminum front panel uses sandblasted anodizing technology, achieving Mohs hardness level 6, resistant to forklift impacts and tool scratches. In embedded installations for medical CT machines, the gap between the panel and equipment housing is controlled within 0.2mm, passing IP66 dust/water resistance certification to prevent disinfectant seepage. Inside smart charging piles, its lightweight design (45mm total thickness) creates more space for power modules, while the sheet metal bracket supports horizontal/vertical dual-mode fixation, adapting to complex cabinet structures.

Anti-Interference and Pressure Endurance: The Ultimate Test for Industrial Scenarios
Having passed 20G vibration tests and 1000-hour salt spray trials, the industrial PC remains rock-steady in port gantry crane control boxes. Even under intense vibrations during lifting operations, the SSD maintains a 0.1ms-level response.

The EMC anti-interference design employs a three-wire grounding shielding method, achieving a touch signal transmission error rate below 0.01% in 10kV substation monitoring scenarios. In a semiconductor cleanroom, the device operated continuously for 3 years at 0.3μm dust concentration without triggering any internal motherboard dust accumulation alarms.